? semiconductor components industries, llc, 2014 august, 2014 ? rev. 2 1 publication order number: mbr1h100sf/d mbr1h100sft3g, NRVB1H100SFT3G surface mount schottky power rectifier plastic sod?123fl package this device uses the schottky barrier principle with a large area metal?to?silicon power diode. ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, pdas and pcmcia cards. typical applications are ac?dc and dc?dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? guardring for stress protection ? low forward voltage ? 175 c operating junction temperature ? epoxy meets ul 94 v?0 ? package designed for optimal automated board assembly ? esd ratings: machine model, c human body model, 3b ? nrvb prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant mechanical characteristics ? reel options: mbr1h100sft3g = 10,000 per 13 in reel/8 mm tape ? device marking: l1h ? polarity designator: cathode band ? weight: 11.7 mg (approximately) ? case: epoxy, molded ? lead finish: 100% matte sn (tin) ? lead and mounting surface temperature for soldering purposes: 260 c max. for 10 seconds ? device meets msl 1 requirements marking diagram l1h = specific device code m = date code = pb?free package http://onsemi.com sod?123fl case 498 schottky barrier rectifier 1.0 amperes 100 volts device package shipping ? ordering information ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbr1h100sft3g sod?123 (pb?free) 10000/tape & re el l1hm NRVB1H100SFT3G sod?123 (pb?free) 10000/tape & re el (note: microdot may be in either location)
mbr1h100sft3g, NRVB1H100SFT3G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 100 v average rectified forward current (t l = 162 c) i o 1.0 a non?repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 50 a storage and operating junction temperature range (note 1) t stg , t j ?65 to +175 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. the heat generated must be less than the thermal conductivity from junction?to?ambient: dp d /dt j < 1/r ja . thermal characteristics characteristic symbol value unit thermal resistance, junction?to?lead (note 2) jcl 23 c/w thermal resistance, junction?to?ambient (note 2) r ja 85 c/w thermal resistance, junction?to?ambient (note 3) r ja 330 c/w electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 4) (i f = 1.0 a, t j = 25 c) (i f = 2.0 a, t j = 25 c) (i f = 1.0 a, t j = 125 c) (i f = 2.0 a, t j = 125 c) v f 0.76 0.84 0.61 0.68 v maximum instantaneous reverse current (note 4) (rated dc voltage, t j = 25 c) (rated dc voltage, t j = 125 c) i r 40 0.5 a ma product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 2. mounted with 700 mm 2 copper pad size (approximately 1 in 2 ) 1 oz fr4 board. 3. mounted with pad size approximately 20 mm 2 copper, 1 oz fr4 board. 4. pulse test: pulse width 380 s, duty cycle 2.0%.
mbr1h100sft3g, NRVB1H100SFT3G http://onsemi.com 3 typical characteristics figure 1. typical forward voltage figure 2. maximum forward voltage v f , instantaneous forward voltage (v) v f , instantaneous forward voltage (v) 0.8 0.6 0.4 0 0.2 0.1 1 10 100 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.1 1 10 100 figure 3. typical reverse current figure 4. maximum reverse current v r , reverse voltage (v) v r , reverse voltage (v) 90 80 60 50 30 20 10 0 0.00001 0.0001 0.001 0.01 0.1 1 10 90 80 60 50 30 20 10 0 i f , forward current (a) i f , forward current (a) i r , reverse current (ma) i r , reverse current (ma) 1.2 1.4 1.0 150 c 125 c 25 c 40 70 100 150 c 125 c 25 c 40 70 100 figure 5. current derating t l , lead temperature ( c) 165 150 145 140 135 0 0.5 1.0 1.5 2.0 i f(av) , average forward current (a) dc square wave 155 170 160 r jl = 23 c/w i o , average forward current (a) 1 0.8 0.6 0.4 0.2 0 0 0.2 0.4 0.6 0.8 1.0 p fo , average power dissipation (w) t j = 175 c dc square wave figure 6. forward power dissipation 0.2 0 150 c 125 c 25 c 0.00001 0.0001 0.001 0.01 0.1 1 10 150 c 125 c 25 c 175 1.6 1.4 1.2
mbr1h100sft3g, NRVB1H100SFT3G http://onsemi.com 4 typical characteristics figure 7. capacitance v r , reverse voltage (v) 80 70 60 50 30 20 10 0 0 20 40 60 80 120 c, capacitance (pf) 40 90 100 100 140 t j = 25 c 0.1 0.00001 pulse time (s) 100 10 0.1 0.01 0.0001 0.001 0.01 1.0 10 100 0.000001 50% (duty cycle) 25% 10% 5.0% 2.0% 1.0% single pulse 1000 r(t) (c/w) 1.0 0.1 0.00001 pulse time (s) 100 10 0.1 0.01 0.0001 0.001 0.01 1.0 10 100 0.000001 50% (duty cycle) 25% 10% 5.0% 2.0% 1.0% single pulse 1000 r(t) (c/w) figure 8. thermal response, junction?to?ambient (20 mm 2 pad) 1.0 1000 figure 9. thermal response, junction?to?ambient (1 in 2 pad)
mbr1h100sft3g, NRVB1H100SFT3G http://onsemi.com 5 package dimensions sod?123fl case 498 issue d notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold flash. 4. dimensions d and j are to be measured on flat section of the lead: between 0.10 and 0.25 mm from the lead tip. d e b a a1 l c polarity indicator optional as needed *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 0.90 0.95 0.98 0.035 inches a1 0.00 0.05 0.10 0.000 b 0.70 0.90 1.10 0.028 c 0.10 0.15 0.20 0.004 d 1.50 1.65 1.80 0.059 e 2.50 2.70 2.90 0.098 l 0.55 0.75 0.95 0.022 0.037 0.039 0.002 0.004 0.035 0.043 0.006 0.008 0.065 0.071 0.106 0.114 0.030 0.037 nom max 3.40 3.60 3.80 0.134 0.142 0.150 h e ? ? 0 8 0 8 top view bottom view side view h e 2x 2x end view recommended dimensions: millimeters 1.25 2x 4.20 1.22 2x 12 p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 mbr1h100sf/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
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